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| > Biotech / Medical / Pharma > CMP > Flat Panel Displays > Flexible Electronics > GaAs > MEMS > Nanotechnology > Optoelectronics > Photovoltaics > Roll to Roll > Semiconductor > Test, Assembly & Packaging |
semiconductor experience | |
| Skyworks Solutions, Inc. | 4 to 6 Inch Conversion Fab Operational During Upgrade // On Site Industrial Engineering Support for Wet/Dry Etch, Thin Films, Materials and Supplies // Facilities Systems Analysis // Utility Matrix Development // Cleanroom Re-Layout to Accommodate Six Inch Tools // On Site Tool Installation Support |
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| Mohawk Valley EDGE | Large Chip Fab Site Site Evaluation: Vibration / EMI / Traffic // Optimize Site Layout // Market Site to IC Manufacturers // Wetlands Permit / Abatement Consulting // Develop Local Support and Infrastructure |
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| Luther Forest Technology Campus Two-Four Fab 300mm Wafer Processing Site // Analysis of Wafer Fab Requirements // Advanced Microprocessors or Memories // Unique 1000 acre Green Site // Verification that planned fab capabilities and design would meet the needs of the 3 largest Wafer Fabrication companies in the world // Successfully Attracted and Sited Wafer Fabrication Facilities // Economic Development and Incentives Modeling // Vibration, RF, EMI and Acoustic Site Survey // Environmental impact evaluation // Community Education Activities // Competitive $1.2 Billion Incentives |
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| ForCon International | Process Equipment Damage Analysis Fair Market Valuation of Damaged Tools // Develop Tool Repair Roadmap and Alternatives |
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| Motorola | Bipolar 100mm, 150mm Wafers, 200mm Wafers Site Renovation Plans // Fab Consolidation, Wafer Size Increases // Phased Layout Scenarios |
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| Fujitsu | 200mm Memory Fab Site
Factory/Capacity and Cost Model // Assist with Sale of Fab and Tools |
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| Hynix Semiconductor | Multi Fab Audit
Benchmark Wafer Costs // 300mm Wafer Fab Strategy // DRAM Technology Integration Plan to 0.13 Micron // Multi Fab Analysis |
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| Medtronic Wafer Fab Capital Spending Plan // Tool Recommendations |
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| Philips Semiconductors | BiCMOS, 0.25 to 0.18 Micron, 200mm Wafer Fab, SMIF 75,000 Square Foot Renovation, including CMP Area // Utility Matrix, Equipment and Room Layouts // Vibration Analysis, Engineering Review, and Automation Plan |
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| Silterra (formerly Wafer Technology) | Awarded Top Fabs of 202 by Semiconductor International Magazine, May 2002 // Green Site // Advanced CMOS, 200mm wafer fab, SMIF, 0.18 Micron // Class 1 to Class 1,000 Environment // Fan Deck, Cleanroom Raised Floor, Ballroom, Subfab // Copper and CMP Processes // Test and Failure Analysis // Layout Development/Optimization // Capacity Analysis // Utility Matrix, Tool Comparison, HPM Analysis // Automation Review // Base Build Consulting Support // EMI Evaluation for Characterization Areas |
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| Littelfuse | Thin film fuses // Manufacturing Technology // Wafer fab and Gas discharge // TVS acquisition evaluation // Technology Transfer //Foundry Search and Evaluation |
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| Wayne State University and Delphi Automotive Systems | Microelectronics Cleanroom Renovation Programming // Layout // Utility Matrix // Tool Relocation from Delphi Auto Research Labs to WSU // Detail Design // Construction Support |
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| Knowles | Bipolar Wafer Fab Wafer Fab Maintenance and Equipment Engineering // Process Setup // Sale of Surplus Wafers // Assistance with Technology Transfer/Outsource |
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| Primarion | Bipolar/BiCMOS/Discrete Fab Fair Market Valuation // Benchmark Fab Sales |
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| Atmel | Operating Fab Building Acquisition 137,000 square foot Cleanroom // Site Evaluations to accommodate 0.18 micron process // Class 1 to Class 1,000 // Multi Level Fab, 2 Subfab Levels, Fan Deck, Ballroom // Layout for 200mm Tools // Utility Matrix // Room Condition Evaluation // Capacity Analysis // HPM Analysis |
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| Micron Technology | 300mm Wafer Fab DRAM Industrial Engineering // Layout // Utility Matrix // Capacity Study / Site Studies |
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| Motorola | Advanced CMOS, 200mm Wafer Fab, 0.35 Micron Equipment Maintenance: Thin films, Ion Implant, CVD, Metrology |
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| Confidential Client Bay/Chase vs. Ballroom Tool Layout Studies for 200mm and 300mm tool sets |
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| Sarnoff | Custom IC Fab Equipment/Process Analysis and Recommendations |
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| FlipChip Technologies | Bump Fab: 4”, 6”, 200mm Wafers Bottleneck Analysis/Modeling // Cycle Time Improvement // Tool Rigging, Wall Configuration, Tool Positioning, Fit-up |
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| Ericsson Components | BIPOLAR, BiCMOS, CMOS Wafer Fabs, 0.35 Micron Evaluate 150mm conversion of existing wafer fabs // Layout optimization // Utility matrix development // Process optimization and operations turnaround // Extensive factory modeling for product mix changes // Equipment engineering and maintenance – etch, photo |
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| Texas Instruments (formerly Unitrode) | 150mm BiCMOS Fab start-up, 0.6 Micron Fab start-up, Operations Management and Process Qualification // Tool installation and acceptance // Wafer process start-up, specification and process development // Etch, Diffusion, CVD, Multi level metal // Consult on 100mm to 150mm conversion of Bipolar Fab. |
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| Advanced Micro Devices | Advanced CMOS Microprocessors, Logic Course development and training: Parametric Testing, Basic Electronics, Wafer Reliability, Semiconductor Physics and Wafer Sort, Class rating 4.8/5 // Multiple fabs / site training support |
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| GMT Microelectronics | Silicon Wafer Foundry Business plan development and market analysis // Process equipment maintenance |
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| White Oak Semiconductor / DPR | 200mm Wafer Fab Review of Conceptual Design |
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| LSI Logic | 200mm Green Site CMOS Wafer Fab Layout – SMIF Fab // Utility Matrix // Programming, Capacity Analysis, Modeling |
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| Hewlett Packard / IDC | 200mm CMOS Wafer Fab Hi-Thruput Fab Facility // Conceptual Design // Mini-Environment //Automation // Layout // Utilities |
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| Reedholm Instruments | Test Equipment Wafer Level Reliability // Equipment Marketing |
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| Delco Electronics / Bump Fab | Bump Wafers – Automotive Bump Fab Phased Renovation of existing fab // Conceptual Design //Layout // Utility Matrix // Phase Planning, Management Presentation |
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| AIL Systems, Division of Eaton | Hi-Rel Hybrids, SAW Devices, Si and GaAs Wafers Campus Consolidation of Fab, Assembly, and Test for Hi-Rel Devices and Hybrids. |
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